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| - Inhibition Due to the Interaction of Polyethylene Glycol, Chloride, and Copper in PlatingBaths: A Surface-Enhanced Raman Study
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| - The synergic effect of poly(ethylene glycol) together with chloride ion for inhibiting copper deposition incopper electroplating has been of particular interest for some time. In this study, the potential-dependentbehavior of poly(ethylene glycol), with or without chloride ion in a copper electroplating bath is investigatedusing the surface-enhanced Raman spectroscopy technique. The presence of chloride proves to play a significantrole in enhancing PEG adsorption to the Cu electrode surface. More importantly, spectroscopic evidencestrongly suggests the formation of a PEG−Cu−Cl complex. By comparing experiment with vibrational modescalculated by using the Hartree−Fock method with a 3-21G* basis set, the structure of this complex is proposedto be a three-coordinated Cu center with two oxygen atoms from PEG and one chloride ligand.
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