| Abstract
| - In this article, we describe a method to create rough features on silicon surfaces by reactive etching of a photoresistlayer. The roughness and, consequently, the wettability of the surfaces can be modified by modifying the durationof plasma etching. Hydrophobic materials deposited on the rough silicon surface can be modified until a superhydrophobicbehavior is obtained, whereas hydrophilic materials become more hydrophilic. The elaboration technique describedherein offers an inexpensive and rapid method for the creation of tunable roughness on silicon surfaces with largeareas.
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