| Abstract
| - Abstract. The application of optoelectronic technologies and data transmission techniques, developed initially for the telecommunications market, to electronic processor systems offers to overcome interconnect limitations facing designers of these high performance systems. Optical interconnects offer increased data rates, low power consumption, compact size and inherent freedom from the effects of mutual coupling, line capacitance, EMI and topological constraints. This paper describes our investigation of two of the key technologies required for the practical implementation of optical interconnections, namely optoelectronic interface components (the optical bond pads), and the associated hybrid alignment techniques used in their assembly.
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