| Abstract
| - Abstract. To reduce fabrication costs of fibre-optic terminal modules for interactive services, an InGaAsP/InP chip fabrication process has been developed for monolithic integration of a strained-layer multiple quantum well laser, a monitor diode and a photoreceiver with a 1300/1530nm filter. Reception responsivity and output power of the chips are 0.1 AW-1 at 1300nm wavelength and 4.5mW at 1530nm wavelength, respectively. At present, complete modules with fibre pigtail exhibit 0.7mW launch power, but 1.4 mW is expected with the latest chips.
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